Global · Enterprise standard

Inconel X750

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Physical properties

vs. temperature
Elastic modulus GPa
128 – 213°C
Mean thermal expansion 10⁻⁶/K
11.7 – 17.6°C
Thermal conductivity W/(m·K)
9.66 – 23.6°C
Specific heat J/(kg·K)
306 – 716°C
Resistivity Ω·mm²/m
1.22 – 1.31°C

Creep properties

-50.7116283449616649760871982MPa
  • 100.0h
  • 1000.0h

Temperature °C · time at rupture

Chemical composition

ElementminmaxSimilarRemarks
Al0.7
Cr15.5
Fe7
Nb1
Ni73
Ti2.5

Physical properties

-200.0

Elastic modulusMean thermal expansionThermal conductivitySpecific heatResistivityDensityPoisson's ratio
11.8810.10334.94

Creep

Temperature ℃Time hCRS
649100.0h551.58
6491000.0h468.84
760100.0h275.79
7601000.0h206.84
871100.0h89.63
8711000.0h48.26
982100.0h20.68
9821000.0h13.79

Similar grades

GradeRegionSystem
Inconel X750United StatesSAE
NW7750International standardISO
N07750United StatesUNS
SB-637 N07750 Type 3United StatesASME
SB-637 N07750 Type 2United StatesASME
SB-637 N07750 Type 1United StatesASME
NiCr15Fe7Ti2AlInternational standardISO