China · YB
08
YB/T 056:1994 — Resilient card wire
Chemical composition
| Element | min | max | Similar | Remarks |
|---|---|---|---|---|
| C | 0.05 | 0.11 | ||
| Cr | 0.1 | |||
| Cu | 0.25 | |||
| Mn | 0.35 | 0.65 | ||
| Ni | 0.3 | |||
| Si | 0.17 | 0.37 |
Mechanical properties
| Heat treatment / condition | Yield strength | Tensile strength | Elongation | Reduction of area | Impact energy | Hardness |
|---|---|---|---|---|---|---|
| bars 0.205mm ≤ d ≤ 0.38mm | 1810–2060 圆形截面 | |||||
| bars 0.405mm ≤ d ≤ 1.215mm | 1720–1960 圆形截面 | |||||
| bars d < 0.63mm | 1810–2210 异形截面 | |||||
| bars d ≥ 0.63mm | 1720–2110 异形截面 |